Nvidia has announced that it is to invest $5 billion in Intel, becoming one of the tech giant's largest shareholders.

Siemens Digital Industries Software has introduced Tessent AnalogTest software – a solution that looks to reduce pattern ...

Microchip Technology has unveiled a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology.

Grinn, a specialist in the design of advanced IoT and embedded solutions, signs a strategic partnership with MediaTek.

Nordic's new nRF54LM20A is the latest addition to its next-generation nRF54L series of ultra-low power wireless SoCs.

With more companies rowing back on their commitments to DEI when did this policy become yet another expendable?

Nexperia has unveiled AEC-Q101 qualified 100 V MOSFETs, in a compact CCPAK1212 (12 x 12 mm) copper-clip packaging.

TI's C2000 real-time MCUs designed to help engineers design consumer products with improved levels of performance.