Abstract: As electronic packages continue to get smaller, designing reliable solder joints is becoming an increasingly important part of the design process. The shape and height of the solder joint ...
Modified C5 Z06 with Magnuson supercharger and documented build shows 54,650 miles.
Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
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