Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

The Integrated Circuits Inspired by Wireless and Biomedical Systems (IC-WiBES) group, led by Prof. Abhishek Srivastava, ...

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...

ABLIC has launched a new line of automotive shunt reference ICs, the S‑19760/1 Series, designed to improve the accuracy of sensor signal processing in demanding vehicle environments. The company says ...

Feb. 19, 2026 — Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC solution. The solution provides a fast, predictable ...

Major PC brands and chip suppliers have recently warned that price increases for PC products in 2026 are likely unavoidable. Rising costs of memory and many other components continue to surge, and if ...

Metal cost volatility is cited in price-increase notices as passive-component hikes spread; MLCC risk shows up first in ...

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital ...

Reliability is now a system-level concern that includes everything from materials and packaging to testing with backside power.

With the dynamic growth and ubiquity of electronic systems globally, software-defined, AI-powered, and silicon-enabled technologies are critical for today’s semiconductor industry, which is projected ...

Cadence Design Systems, Inc. (NASDAQ:CDNS) Q4 2025 Earnings Call Transcript February 17, 2026 Cadence Design Systems, Inc.

A quick guide to designing an eye-catching Steam thumbnail that stands out and attracts players at first glance. #SteamDev #GameMarketing #IndieGames ...