Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

The Integrated Circuits Inspired by Wireless and Biomedical Systems (IC-WiBES) group, led by Prof. Abhishek Srivastava, ...

ABLIC has launched a new line of automotive shunt reference ICs, the S‑19760/1 Series, designed to improve the accuracy of sensor signal processing in demanding vehicle environments. The company says ...

Feb. 19, 2026 — Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC solution. The solution provides a fast, predictable ...

Metal cost volatility is cited in price-increase notices as passive-component hikes spread; MLCC risk shows up first in ...

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital ...

With the dynamic growth and ubiquity of electronic systems globally, software-defined, AI-powered, and silicon-enabled technologies are critical for today’s semiconductor industry, which is projected ...

By identifying emerging trends, gaps, and best practices, Axtria's benchmarking study enables life sciences organizations to design incentive programs aligned with market realities, motivate ...

Cadence Design Systems, Inc. (NASDAQ:CDNS) Q4 2025 Earnings Call Transcript February 17, 2026 Cadence Design Systems, Inc.

As worldwide markets for electric vehicles continue to gain market share, low-cost connections of vehicles to mains charging need to be safe and efficient.

At CES, MPS highlighted how its motor-control ICs can enable smarter, more precise control of brushless DC motors that are multiplying across robotics and other industries.

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: ...